| Model |
Name |
Appearance |
Total Thickness (mm) |
Adhesion (kg/25mm) |
Tensile Strength (kg/25mm) |
Elongation (%) |
Thermal Resistance (℃) |
Storage Conditions (temperature in ℃ and humidity in %) |
Purpose & Characteristic |
| HAR-0601 |
Gold-inlaid blue tape |
Blue |
0.10±0.02 |
0.10-0.20 |
≥5.0 |
≥140 |
80.0 |
25.0±5.0
50.0-80.0 |
Used for gold-plated, chemical and OSP gold finger protection of hard boards.
With potion resistance, no residual rubber, no plating penetration, soft original film and good adhesion. |
| HAR-0602 |
Chemical gold blue tape |
Blue |
0.10±0.02 |
0.10-0.20 |
≥5.0 |
≥140 |
100.0 |
25.0±5.0
50.0-80.0 |
Used for chemical nickel, chemical silver and OSP gold finger protection of hard boards.
Used in the chemical gold edge and other process or porous gold-plated boards; and conducive to reduction of residual rubber on the porous ring.
Special design of original film and no stripping or plating penetration.
|
| HAR-0602A |
Chemical gold green tape |
Green |
0.15±0.02 |
0.15-0.25 |
≥5.0 |
≥140 |
150.0 |
25.0±5.0
50.0-80.0 |
Used for chemical nickel, chemical silver and OSP gold finger protection of hard boards.
Used in the chemical gold edge and other process or porous gold-plated boards; and conducive to reduction of residual rubber on the porous ring.
Special design of original film and no stripping or plating penetration.
|
| HAR-0603 |
Blue tape for soft board |
Blue |
0.096±0.020 |
0.03-0.07 |
≥5.0 |
≥140 |
80.0 |
25.0±5.0
50.0-80.0 |
Dedicated to protection of FPC soft board process. Resistance to chemical liquid medicine corrosion, stable adhesion and no residual rubber. Used for pasting of release paper. |
| HAR-0604 |
Blue tape for aluminum substrate |
Blue |
0.096±0.020 |
0.03-0.07 |
≥5.0 |
≥140 |
80.0 |
25.0±5.0
50.0-80.0 |
Dedicated to protection of aluminum-baseline circuit boards. Resistance to chemical liquid medicine corrosion, no residual rubber after stripping, small elongation and small stripping force. |
| HAR-0801 |
Red tape with high temperature resistance |
Red |
0.26±0.02 |
3.0-15.0 |
≥15.0 |
≥8.0 |
300.0 |
25.0±10.0
40.0-90.0 |
Used in tin-spraying gold finger protection process of PCB.
Excellent high temperature resistance, no layering, no residual rubber and no tin penetration.
|
| HAR-0901 |
Gold-inlaid green tape |
Green |
0.06±0.01 |
≥0.08 |
≥3.0 |
≥30 |
200.0 |
25.0±10.0
40.0-90.0 |
Used for gold plating, silver plating, tin plating and OSP gold finger protection of PCB.
Used in chemical gold edge and other processes.
Resistance to chemical liquid medicine corrosion and high temperature, and no residual rubber or plating penetration. |
